Complete Team Structure
- Experienced chip R&D team
- Long-term market and sales accumulation
- Practical system application R&D team
- Mass production and manufacturing management team
Wi-Fi HaLow™
Wi-Fi HaLow chips and modules for long-range, low-power video, doorbells, bridges, and NVR kits.
Wi-Fi SOC
Wi-Fi SOC series for video transmission, smart home, and single-chip wireless connectivity applications.
Wi-Fi Transceiver
Wireless transceiver chips with datasheets, hardware design guides, drivers, and firmware resources.
Create Intelligent Futures With Taixin
Professional Support From Taixin Technical Experts
Self-Service Resources And Downloads
Centralized product resources, FAQs, download entries, and integration notes help engineering teams quickly find what they need.
It covers early product screening, resource review, and preparation before sample evaluation to reduce repeated communication.
It is suited for project feasibility checks, solution comparison, and internal technical reviews.
Core Competence
Build lasting advantages through team strength, R&D, design, and industrialization.
Chip R&D Capability
- Experienced digital SOC design team
- Mixed-signal circuit design for mass production
- Self-developed high-performance baseband team
- High-performance RF design team
Large-Scale Chip Design
- Wireless transmission chip mass production experience
- Complex industrial-grade SOC design experience
- High-performance low-power chip mass production experience
- Large-scale chip production and test experience
Industrialization Capability
- Customer resources for early project introduction
- Custom specifications for target customers
- Mature production management system
- Complete quality management system
Latest Taixin Updates
Physical AI Deployment Enters a Pivotal First Year: Taixin Semiconductor Bridges the Full-Spectrum Intelligent Link of the Physical World via Edge AI Communication Foundation
When AI steps out of the cloud and into the physical world, why do 90% of devices still "run poorly, connect poorly, and last briefly"? In 2026, global artificial intelligence will reach a decisive inflection point — Physical AI and Edge AI officially enter their first year of scaled implementation. According to the latest data from Frost & Sullivan, the global edge AI chip market size exceeded $10 billion in 2024, with a compound annual growth rate (CAGR) exceeding 40%, projected to surge to $32.55 billion by 2030. From embodied robots, AI glasses to...
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