News detail
TXW82X Gains Industry Recognition Again, Taixin Invited to Speak at China IC Unicorn Forum
November 10
The 9th China IC Unicorn Forum 2026
and the China Semiconductor Industry High-Quality Development Innovation Forum
was held at the Shanghai New International Expo Center
After recently being recognized in the 21st "China Chip" Awards
Taixin Semiconductor's self-developed
audio/video Wi-Fi/Bluetooth/NearLink tri-mode SOC chip
TXW82X
has once again received industry recognition and won
"2025-2026 China SemiconductorWireless Communication Chip Outstanding Product" Award
and was also selected as
"2025-2026 China IC Unicorn Enterprise"
At the same time as the award ceremony
was invited to take
Brain-Computer Interfaces: Installing a China Chip in the Mind
as the topic of a keynote speech
01
What does this award assess?
The "China Semiconductor Industry High-Quality Development Innovation Achievements" solicitation was launched by the China IC Unicorn Alliance, covering areas such as integrated circuit design, manufacturing, packaging and testing, materials, and equipment. It has three categories: Leading Figures, Leading Enterprises, and Outstanding Solutions/Products, evaluating both technology and market implementation. This year, there are six Outstanding Solutions/Products in total, spanning MEMS, test equipment, sensors, display drivers, wireless communication chips, and other areas.
The TXW82X integrates Wi-Fi, Bluetooth Low Energy (BLE), and SparkLink (NearLink) wireless protocols into a single chip, making it a tri-mode SoC for wireless audio and video transmission. The chip features a built-in ISP and dual hardware codecs for H.264 and MJPEG, supports stable 1080P@30fps output, and has been adopted in mass-produced terminals such as pocket gimbal cameras, detachable action cameras, HD video intercoms, and AI glasses. It covers both the consumer electronics and security markets—precisely the market performance that this selection values.
02
Brain-Computer Interfaces Give Thought a Chinese Chip
After the award ceremony, Taixin took the stage again to deliver a keynote speech.
The common engineering bottleneck in brain-computer interfaces today is how to process and transmit massive, weak, high-speed neural signals in real time and with low power. Taixin's TXW8601 is positioned for 'high-throughput neural signal processing and low-power wireless transmission.' It performs lossless neural signal compression and spike detection on-chip, moving processing closer to the signal source so that only compressed signals are transmitted over the wireless link.
Currently, TXW8601 is in the R&D verification stage. The FPGA prototype system has verified the SoC's main functions; the single-channel compression component achieves processing speeds above 80Mbps, and the phased average lossless compression ratio exceeds 55%; the Cerebus™ multichannel neural data recording system has been built and put into algorithm testing.
From Wi-Fi HaLowTMto tri-mode integrated audio and video SoCs, and then to neural signal processing, Taixin is doing the same thing: integrating edge-side signal processing and low-power wireless transmission into a single chip.
In the future
Taixin Semiconductor will continue to increase R&D investment
and work with industry chain partners to drive
the high-quality development of the integrated circuit industry
Zhuhai Taixin Semiconductor Co., Ltd. was founded in November 2016. It is a national-level specialized, refined, distinctive and innovative 'Key Little Giant' enterprise focused on chip design for the AIoT field and has been listed on the 'China IC Unicorn' list. With outstanding technical strength, the company's products have won the prestigious 'China Chip' industry honor three times.
The company has deep expertise in core technologies for wireless communications and audio/video processing, with full-stack independent R&D capabilities covering baseband, protocol stacks, and RF circuits. As one of the world's first companies to achieve mass production of Wi-Fi HaLowTMchips, Taixin has established a first-mover advantage in long-range IoT with its superior penetration and ultra-low power consumption. At the same time, the company was among the first to launch an audio/video SoC integrating SparkLink technology, fully empowering cutting-edge audio/video scenarios such as AI glasses, HD drone image transmission, and video doorbells with low latency and strong anti-interference performance.
In terms of technology layout, the company has proactively deployed LTE Cat.1 chips, further improving its mid-rate IoT technology portfolio and successfully building a 'wireless + cellular' dual-technology-driven system. Its product matrix comprehensively covers ultra-long-range, low-power, multi-protocol integration, and complex industrial-grade scenarios, broadly empowering diverse fields such as consumer electronics, security surveillance, smart home, embodied robots, connected vehicles, and industrial internet. It has won recognition and large-volume shipments from many leading customers, including Hikvision.
As an active promoter of the industry ecosystem, Taixin Semiconductor is a full member of the Wi-Fi Alliance, SparkLink Alliance, Wi-Sun Alliance, and RISC-V Alliance. In the future, the company will continue to uphold its corporate culture of 'diligence, innovation, pragmatism, and growth,' and through continuous technological innovation and application expansion, provide global customers with high-performance, stable, reliable, and cost-effective one-stop AIoT chips and solutions, helping drive the flourishing development of the era of ubiquitous intelligent connectivity.
Company Profile /Company Introduction