Taixin Semiconductor
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Wi-Fi SOC Chip

TXW812

Low-power high-performance 2.4GHz Wi-Fi + low-power wireless multimode IoT SoC

Integrates IEEE 802.11 b/g/n baseband, RF front end, a 32-bit microprocessor, rich peripherals, power management and security modules for low-power connected terminals and smart devices.

Product Overview

TXW812 is a low-power, high-performance and highly integrated 2.4GHz Wi-Fi plus low-power wireless multimode IoT SoC. It integrates the IEEE 802.11 b/g/n baseband and RF circuits, including the PA power amplifier, LNA low-noise amplifier, RF balun, antenna switch and power management modules, making it suitable for compact connected devices with strict power and cost targets.

The TXW812 Wi-Fi baseband implements OFDM and remains backward compatible with DSSS and CCK, supporting the IEEE 802.11 b/g/n protocol family. It supports 20MHz standard bandwidth as well as 5MHz and 10MHz narrow-band configurations, with a maximum PHY rate of 72.2Mbit/s for flexible tradeoffs among throughput, coverage and power consumption.

The chip integrates a high-performance 32-bit microprocessor and provides USB2.0 High Speed Host/Device, SDMMC Host, RMII MAC, SPI Master & Device, UART, IIC, IIS, PDM, IR Send/Receive, PWM, GPIO, ADC/DAC and other peripheral interfaces. It also supports SDIO2.0 Slave up to 50MHz, runs programs from SPI Flash, and includes RTOS support, third-party components and an open development and debugging environment for fast product delivery.

TXW812 WI-FISOC Architecture Diagram
TXW812 WI-FISOC architecture diagram

Product Features

01

Highly Integrated 2.4GHz Wi-Fi SoC

Integrates IEEE 802.11 b/g/n Wi-Fi baseband and RF circuitry with built-in PA, LNA, RF Balun, antenna switch and power management modules, delivering up to 72.2Mbps PHY rate.

TXW812 highly integrated Wi-Fi SoC illustration
02

High-Performance MCU and Storage

Includes a CK803 32-bit processor running up to 240MHz, 272KB SRAM, support for external SPI Flash and PSRAM, and XIP execution for flexible firmware design.

TXW812 MCU and storage resources illustration
03

Rich Peripheral Interface Capability

Supports USB2.0 HS, SDIO2.0, SD Host, RMII, QSPI, SPI, UART, IIC, IIS/PCM, PDM, PWM, GPIO, ADC/DAC and other interfaces for compact IoT products.

TXW812 rich peripheral interface illustration
04

Low Power and Battery Optimization

Supports ULP and LP low-power modes, with ULP current below 28μA@25℃ and multi-channel IO wake-up, making it suitable for battery-powered equipment.

TXW812 low-power battery optimization illustration
05

Security, Reliability and Industrial Fit

Supports WPA/WPA2/WPA3, integrates AES, SHA256, CRC and TRNG, supports SPI Flash firmware encryption protection, and operates across -40℃ to 85℃.

TXW812 security and industrial reliability illustration

Parameters

ChipChip ModelControllerFrequencyPackageGPIORAM/ROMFlashInterfacesVoltage
T
TXW812
TXW812-310CK803240QFN3217272*10241024PWM, RTC, UART, SPI, IIC, USB3 ~ 3.6