Taixin Semiconductor

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What Is the Most Challenging Part of Developing Smart Products? Taixin Provides the Answer at the China International SME Fair

2026-09-03

On September 3, the 21st China International Small and Medium Enterprises Expo (the “SME Expo”) opened in Area D of the China Import and Export Fair Complex in Guangzhou. Centered…

September 3

The 21st China International Small and Medium Enterprises Expo

(the “SME Expo”)

opened in Area D of the China Import and Export Fair Complex in Guangzhou

This year’s expo is themed “Empowering SMEs with Artificial Intelligence”

and features themed exhibition areas for specialized, sophisticated, distinctive, and innovative enterprises from provinces, autonomous regions, and municipalities

as well as exhibitors from Hong Kong, Macao, Taiwan, and international markets

Zhuhai Taixin Semiconductor, as a

national-level specialized, sophisticated, distinctive, and innovative “Key Little Giant” enterprise

was invited to participate

Approved by the State Council and organized by the Ministry of Industry and Information Technology, the SME Expo was founded in 2004 and permanently established in Guangzhou. It is the highest-level and largest international event for small and medium-sized enterprises in the Asia-Pacific. “See the big picture through the small, and explore the world through the expo” has been its guiding principle for more than two decades.

Participating companies must be selected through multiple rounds of screening by the organizers and provincial and municipal authorities, with specialized, sophisticated, distinctive, and innovative enterprises representing an important segment.

 19.2A04 

. 01

Why was Taixin selected?

Zhuhai Taixin Semiconductor is one of the companies invited to participate this year. Its ability to stand out through multiple rounds of screening stems from its long-standing focus on AIoT chip design.

National-level specialized, sophisticated, distinctive, and innovative “Key Little Giants” occupy the top tier of the development system for specialized, sophisticated, distinctive, and innovative enterprises. Selected from among tens of thousands of SMEs, “Little Giants” are already outstanding performers, while only a small number earn the “Key” designation. Taixin is one of the few chip design companies in Zhuhai to receive this recognition. It was also previously named a “China IC Unicorn” and has won the “China Chip” Outstanding Product Award twice. From AIoT chip design to a full-stack portfolio spanning wireless connectivity, audio and video sensing, and edge-side AI, Taixin’s selection is supported by its sustained accumulation of mass-produced chips and real-world applications.

Why should a company that develops foundational chips appear at an SME expo? Because chips are precisely the part of the value chain that is most difficult for SMEs to access—and Taixin’s goal is to lower the barriers to this part of the process.

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. 02

Explore connectivity and sensing solutions in one stop at the booth

At this expo, Taixin is showcasing product lines covering the two core capabilities at the foundation of the Internet of Things: connectivity and sensing.

For wireless connectivity, TXW8301 is the world’s first Wi-Fi HaLow™ SoC to enter mass production. It supports unlicensed sub-1 GHz frequency bands, offers a maximum transmission distance of 1,500 meters, supports up to 8,191 nodes on a single network, and has standby power consumption as low as 200 μA. Devices requiring demanding connectivity range and stability, including robotic lawn mowers, wireless cameras, and baby monitors, have adopted it. TXW82X integrates a high-performance ISP and StarFlash transmission, supports 1080P@30fps hardware encoding and decoding, and is designed for applications such as AI glasses, wireless IPCs, and video doorbells. TXW901 is a Wi-Fi/BLE transceiver for IoT applications.

For audio and video sensing and edge-side AI, TXW81X is designed for AI foundation model applications. It can connect to mainstream cloud-based foundation models and provide edge-side computing support for products such as AI toys and AI companion devices. SMEs can therefore equip their products with intelligent capabilities such as voice interaction and visual perception without building their own algorithm teams.

. 03

Make chips smaller and more specialized, enabling SMEs to afford AI

The theme of the SME Expo is “Empowering SMEs with Artificial Intelligence.” Applied to chips, this is exactly what Taixin is doing: making chips smaller and more specialized, lowering the cost and barriers to edge-side AI, and enabling more SMEs to afford and deploy AI. The connectivity and sensing capabilities behind applications such as AI toys, smart security, and wireless cameras are all integrated by Taixin into a single SoC.

For the SMEs visiting the expo, Taixin’s booth presents more than chip specifications; it presents a possibility—the possibility of making products smarter.

On the opening day, the Taixin booth already attracted a steady stream of professional visitors.

The 21st China International Small and Medium Enterprises Expo

Running through September 6

Area D, China Import and Export Fair Complex

19.2A04 Guangdong Exhibition Area

Taixin looks forward to connecting with you in person

Zhuhai Taixin Semiconductor Co., Ltd. was established in November 2016. It is a national-level specialized and sophisticated enterprise that produces new and unique products, recognized as a “Key Little Giant,” specializing in chip design for the AIoT sector. The company has also been named to the “China IC Unicorn” list. With its outstanding technical capabilities, the company’s products have twice received the prestigious “China Chip” industry honor.

The company has focused on core wireless communications and audio and video processing technologies, with comprehensive in-house R&D capabilities spanning baseband, protocol stacks, and RF circuits. As one of the first companies worldwide to achieve mass production of Wi-Fi HaLowTMchips, Taixin has established a first-mover advantage in long-range IoT applications through their exceptional penetration and ultra-low power consumption. At the same time, the company pioneered audio and video SoC chips integrating SparkLink technology. With low latency and strong interference resistance, these chips comprehensively empower cutting-edge audio and video applications, including AI glasses, high-definition drone video transmission, and video doorbells.

In terms of technology strategy, the company has taken a forward-looking approach by developing LTE Cat.1 chips, further strengthening its mid-speed IoT technology portfolio and successfully establishing a dual-technology platform driven by “wireless + cellular.” Its product portfolio comprehensively covers ultra-long-range, low-power, multi-protocol integration, and complex industrial-grade applications. These products are widely deployed across diverse fields, including consumer electronics, security and surveillance, smart homes, embodied robotics, connected vehicles, and the Industrial Internet, and have earned recognition from numerous leading customers, including Hikvision, with shipments already reaching mass-production volumes.

As an active contributor to the industry ecosystem, Taixin Semiconductor is a full member of the Wi-Fi Alliance, SparkLink Alliance, Wi-SUN Alliance, and RISC-V International. Looking ahead, the company will continue to uphold its corporate culture of “Diligence, Innovation, Pragmatism, and Growth.” Through continuous technological innovation and application expansion, Taixin will provide global customers with high-performance, stable, reliable, and cost-effective one-stop AIoT chips and solutions, contributing to the thriving development of the era of intelligent connectivity for everything.

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