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What Is the Most Challenging Part of Developing Smart Products? Taixin Provides the Answer at the China International SME Fair
On September 3, the 21st China International Small and Medium Enterprises Expo (the “SME Expo”) opened in Area D of the China Import and Export Fair Complex in Guangzhou. Centered…

September 3
The 21st China International Small and Medium Enterprises Expo
(the “SME Expo”)
opened in Area D of the China Import and Export Fair Complex in Guangzhou
This year’s expo is themed “Empowering SMEs with Artificial Intelligence”
and features themed exhibition areas for specialized, sophisticated, distinctive, and innovative enterprises from provinces, autonomous regions, and municipalities
as well as exhibitors from Hong Kong, Macao, Taiwan, and international markets
Zhuhai Taixin Semiconductor, as a
national-level specialized, sophisticated, distinctive, and innovative “Key Little Giant” enterprise
was invited to participate



. 01
Why was Taixin selected?

. 02
Explore connectivity and sensing solutions in one stop at the booth
. 03
Make chips smaller and more specialized, enabling SMEs to afford AI
The 21st China International Small and Medium Enterprises Expo
Running through September 6
Area D, China Import and Export Fair Complex
19.2A04 Guangdong Exhibition Area
Taixin looks forward to connecting with you in person
Zhuhai Taixin Semiconductor Co., Ltd. was established in November 2016. It is a national-level specialized and sophisticated enterprise that produces new and unique products, recognized as a “Key Little Giant,” specializing in chip design for the AIoT sector. The company has also been named to the “China IC Unicorn” list. With its outstanding technical capabilities, the company’s products have twice received the prestigious “China Chip” industry honor.
The company has focused on core wireless communications and audio and video processing technologies, with comprehensive in-house R&D capabilities spanning baseband, protocol stacks, and RF circuits. As one of the first companies worldwide to achieve mass production of Wi-Fi HaLowTMchips, Taixin has established a first-mover advantage in long-range IoT applications through their exceptional penetration and ultra-low power consumption. At the same time, the company pioneered audio and video SoC chips integrating SparkLink technology. With low latency and strong interference resistance, these chips comprehensively empower cutting-edge audio and video applications, including AI glasses, high-definition drone video transmission, and video doorbells.
In terms of technology strategy, the company has taken a forward-looking approach by developing LTE Cat.1 chips, further strengthening its mid-speed IoT technology portfolio and successfully establishing a dual-technology platform driven by “wireless + cellular.” Its product portfolio comprehensively covers ultra-long-range, low-power, multi-protocol integration, and complex industrial-grade applications. These products are widely deployed across diverse fields, including consumer electronics, security and surveillance, smart homes, embodied robotics, connected vehicles, and the Industrial Internet, and have earned recognition from numerous leading customers, including Hikvision, with shipments already reaching mass-production volumes.
As an active contributor to the industry ecosystem, Taixin Semiconductor is a full member of the Wi-Fi Alliance, SparkLink Alliance, Wi-SUN Alliance, and RISC-V International. Looking ahead, the company will continue to uphold its corporate culture of “Diligence, Innovation, Pragmatism, and Growth.” Through continuous technological innovation and application expansion, Taixin will provide global customers with high-performance, stable, reliable, and cost-effective one-stop AIoT chips and solutions, contributing to the thriving development of the era of intelligent connectivity for everything.
Company Introduction /Company Introduction




