Strong Chip Makes the List! Taixin TXW82X Wins the "2026 Strong Chip TOP100" Innovation Breakthrough Award

The conference was themed "AI Empowerment · Intelligently Creating the Future of Chips"

bringing together companies from across the industry chain, including chip design, complete systems, and terminal applications

upstream and downstream companies across the industry chain

During the conference

the results of the "2026 Strong Chip TOP100" selection were announced

Taixin Semiconductor's

Wi-Fi/BLE/StarFlash tri-mode integrated audio and video wireless chip TXW82X

stood out from nearly 400 products entered for consideration

and was successfully included in the TOP100 list

For Taixin Semiconductor, this is more than an honor; it is comprehensive recognition of its product definition, core technologies, engineering capabilities, and mass-production experience.

The TXW82 series is an audio and video SoC designed for smart terminals. Built on wireless connectivity and audio and video processing, it serves application scenarios that require stable transmission, low-latency response, and continuous intelligent upgrades.

In terminals such as smart cameras, sports DV cameras, dashcams, Wi-Fi body-worn cameras, and doorbells, the user experience is not simply about whether a connection can be established. It is also about whether images are clear, connections are stable, responses are timely, and the device can continue to operate reliably in complex environments. The TXW82 series was designed around these core requirements.

From product specifications to real-world experience, the value of the TXW82 series goes beyond any single performance metric. Its value lies in integrating key capabilities—including wireless connectivity, image processing, and audio and video encoding and decoding—into a single chip, providing terminal products with a more reliable and easier-to-deploy overall solution.

This award recognizes precisely this approach: solving real terminal challenges through chip capabilities and bringing technology from the specification sheet into practical applications through mass-produced products.

What Taixin is building is not an isolated chip, but a product roadmap for intelligent edge terminals.

Over the past year, large models have become a major industry focus. For terminal manufacturers, however, whether AI delivers real value must ultimately be assessed in the context of specific products. AI depends not only on computing power, parameters, and algorithms, but also on connectivity. If a device cannot connect to the internet, transmit images, or access the cloud, none of its capabilities can be realized.

Taixin Semiconductor has long been dedicated to wireless communications and audio/video processing, covering key areas including baseband, protocol stacks, and RF circuits, while continuously integrating AI technologies with audio/video SoCs. This accumulated expertise ensures that edge AI is more than just a concept—it can become a deliverable, mass-producible capability for end products.

At the forum, Mr. Xiang noted that edge AI is not intended to replace the cloud. Instead, it works in coordination with a layered neural system spanning the cloud, edge, and endpoint. The cloud handles broader understanding and computation, the edge is responsible for localized perception and processing, and edge AI delivers immediate responses with lower latency, greater personalization, and enhanced data privacy.

This also explains Taixin’s view of product evolution: the value of a chip lies not only in “connecting audio and video,” but also in providing the foundation for end products to coordinate connectivity, perception, processing, and intelligent inference.

Taixin’s three major chip series—TXW82X, TXW81X, and TXW8301—are now all in mass production. From SparkLink audio/video SoCs and Wi-Fi HaLow™ long-range connectivity SoCs to edge AI large-model audio/video SoCs, the foundational capabilities for connectivity, perception, processing, and intelligent inference have been progressively brought to market.

From the TXW82 series winning the award to the continued deployment of Wi-Fi HaLow™ and edge AI audio/video products, Taixin Semiconductor has consistently invested in the most fundamental—and most critical—capabilities of smart terminals.

The future of edge AI lies not in piling up isolated functions, but in the coordination of “perception–connectivity–processing–intelligence.” Only when chips offer stable connectivity, a solid audio/video foundation, and practical edge intelligence can terminal devices perceive their environments more proactively, respond more promptly in real-world scenarios, and deliver a reliable user experience.

Looking ahead, Taixin will continue working with industry chain partners to advance the deployment of edge AI. With stable, reliable, and mass-producible chip solutions, Taixin will provide foundational support for more smart terminal products.