Taixin Semiconductor

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How to Build a Bestselling Video Intercom: Taixin Offers Three Tiers of Answers

2026-10-11

The two devices connect automatically once powered on

Children can then, through the screen,

see each other and talk directly over voice

In the past two yearschildren's video intercoms have become a hitAmazon, TikTok Shop, TEMU can all carry them

As children's video intercoms gain traction in overseas markets, the products are gradually expanding from basic intercom to experiences such as voice interaction, photo sharing, and multi-device connectivity.

Three Chips

Covering Different Product Positioning

TXW817-810

Entry-Level Basic Tier

TXW817-810 targets basic video intercom products. It adopts an 80K-pixel SPI-interface CMOS sensor, MJPEG encoding, and a CK803 main controller running at 240MHz, and supports 2.4GHz Wi-Fi direct connection.

The solution is designed around a basic intercom experience that lets users see, hear, and connect, making it suitable for products with relatively simple feature requirements.

TXW818-C04F

Mainstream Interactive Tier

TXW818-C04F continues the CK803 main control platform, upgrades the camera to 300K pixels, and is equipped with 4MB PSRAM and an external FEM (GSR2701).

Beyond basic intercom, the solution also supports interactive features such as chat, voice messaging, and photo sharing, adding more ways for products to communicate.

TXW827-C04F

High Image Quality and Multi-Device Expansion Tier

TXW827-C04F uses the TXW82X series platform, has a built-in ISP, supports MIPI CMOS, and offers camera options of 1MP or 2MP; it also supports H.264 hardware encoding and decoding, features a dual-core E804 main controller, and is equipped with 368KB + 4MB PSRAM and an external FEM (GSR2701).

In product applications, this solution can support higher image quality and allows one main unit to connect to multiple sub-units, making it suitable for products with higher requirements for image performance and multi-device interaction.

The three solutions each have their own emphasis

Not which one replaces which

but rather what extra thing each one does

Start from the product experience

Plan solution capabilities

The video intercom experience is mainly reflected in image quality, interaction, connectivity, and battery life. Different product positioning can be configured around these aspects.

01

Image Performance

Images captured by the camera must be processed and encoded before they can be transmitted and displayed on the screen. TXW817-810 and TXW818-C04F use MJPEG encoding, while TXW827-C04F supports H.264 hardware encoding and decoding and can be paired with higher-resolution cameras, providing options for different image quality requirements.

Interactive Features

02

Basic video intercom meets the need to see and speak. If the product is intended to add features such as micro-chat, voice messaging, and photo sharing, the appropriate chip and software solution can be selected based on the overall product design.

03

Device Connectivity

The solution supports Wi-Fi direct connection between devices. The pairing method can be designed according to the product experience, such as button pairing or automatic pairing after an SSID is preset, making it easier for users to complete device connection.

Power Consumption Design

04

Children's video intercoms are usually battery-powered, and the camera, screen, and wireless communication jointly affect overall power consumption. During product development, a comprehensive design must take into account usage scenarios, battery life targets, and battery configuration.

How to Choose the Right Solution?

Start with the experience the product is intended to deliver.

The product must be pushed to the lowest cost and aimed at high-volume sales.

TXW817-810

Beyond intercom

You also want features such as micro-chat, voice messaging, and photo sharing.

TXW818-C04F

Significantly clearer images and significantly longer range.

Or you need one device to connect to multiple devices.

TXW827-C04F

The first two are differences in degree.

The third is different.

Image quality, range, and one-to-many.

These are capability boundaries at the chip level.

They cannot be compensated for by software.

These capabilities can also extend to more product forms.

Image capture, audio/video processing, wireless connectivity, and low-power design are key capabilities in video intercom solutions. These capabilities can also be extended according to product requirements to applications such as video doorbells, voice-interactive toys, small appliances with screens, baby monitors, pet cameras, and high-definition image transmission.

From TXW817-810 to TXW827-C04F, Taixin Semiconductor offers chip options with different configurations. The related solutions share a common development framework, and the SDK, reference designs, production testing methods, and network provisioning processes can be used for specific projects to help customers carry out product development and validation.

Solution Support Beyond the Chip

For video intercom product development, Taixin Semiconductor provides reference designs and SDKs, and its technical team can support network provisioning, production testing, and audio/video pipelines to help customers implement solutions.

Currently, children's video intercoms based on Taixin solutions have been introduced into the supply chains of leading overseas retail channels and well-known IP brands. All three solution tiers are implemented via point-to-point direct connections, with call latency of approximately 100 ms.

From basic intercom to HD video quality and multi-device connectivity

Taixin's three chip solutions cover multiple tiers of requirements

Flexible selection to match product planning

Taixin provides chips and development support

You are welcome to contact the Taixin team to discuss solutions

Zhuhai Taixin Semiconductor Co., Ltd. was established in November 2016. It is a national-level specialized, refined, distinctive, and innovative 'Key Little Giant' enterprise focused on chip design in the AIoT field, and has been listed among China's IC Unicorns. With outstanding technological strength, the company's products have twice won the prestigious 'China Core' industry honor.

The company has deep expertise in core wireless communication and audio/video processing technologies, and possesses full-stack independent R&D capabilities across baseband, protocol stack, and RF circuits. As one of the world's first companies to achieve Wi-Fi HaLow™chip mass production, Taixin has established a first-mover advantage in long-distance IoT with ultra-strong penetration and ultra-low power consumption. At the same time, the company took the lead in launching audio/video SoC chips integrated with SparkLink technology, fully empowering cutting-edge audio/video scenarios such as AI glasses, HD drone image transmission, and video doorbells with low latency and strong anti-interference performance.

In terms of technology layout, the company has made forward-looking arrangements for LTE Cat.1 chips, further improving its medium-rate IoT technology portfolio and successfully building a 'wireless + cellular' dual-technology-driven system. Its product matrix fully covers ultra-long-distance, low-power, multi-protocol convergence, and complex industrial-grade scenarios, broadly empowering diverse fields such as consumer electronics, security monitoring, smart home, embodied robotics, connected vehicles, and the Industrial Internet, and has gained recognition and large-volume shipments from many leading customers including Hikvision.

As an active promoter of the industry ecosystem, Taixin Semiconductor is a full member of the Wi-Fi Alliance, SparkLink Alliance, Wi-SUN Alliance, and RISC-V Alliance. In the future, the company will continue to uphold its corporate culture of 'Diligence, Innovation, Pragmatism, and Growth' and, through continuous technological innovation and application expansion, provide global customers with high-performance, stable, reliable, and cost-effective one-stop AIoT chips and solutions, helping drive the flourishing development of the era of ubiquitous intelligent connectivity.

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